KY-8030

True 3D Volume Measurement
- The true volume of solder pastes on PCBs using Koh Young's authentic 3D profilometry method

Basic Functions of KY-8030
- Paste defects detection including insufficient / excessive / missing paste, shape deformity, bridging and paste displacement

New & Innovative SPI for Chinese Users
- Small Footprint for Efficient Line Integration
- Lowest Cost of Ownership
- Chinese User Interface for Intuitive Operation